Convex-cost flow based redundant-via insertion with density-balance consideration

Wei Guo*, Song Chen, Mei Fang Chiang, Jian Wei Shen, Takeshi Yoshimura

*この研究の対応する著者

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

As VLSI design complexity continues to increase, the yield loss due to via failure becomes more and more significant. Redundant via insertion is highly recommended for improving chip yield and reliability. In this paper, we study the redundant via insertion problem in a post-routing stage, where a single via can have at most one redundant via inserted next to it .The goal is to insert as many redundant vias as possible and, at the same time, try to equilibrate the via density, which is good for the via density rules. We propose a convex-cost flow based approach to solve the problem within up to three routing layers. The experimental results show that, the proposed method can produce optimal solutions on defined density grid structure with maximum redundant via insertion, and achieve an at least 32.61% improvement of via density equalization.

本文言語English
ホスト出版物のタイトルASICON 2009 - Proceedings 2009 8th IEEE International Conference on ASIC
ページ1280-1283
ページ数4
DOI
出版ステータスPublished - 2009
イベント2009 8th IEEE International Conference on ASIC, ASICON 2009 - Changsha
継続期間: 2009 10 202009 10 23

Other

Other2009 8th IEEE International Conference on ASIC, ASICON 2009
CityChangsha
Period09/10/2009/10/23

ASJC Scopus subject areas

  • ハードウェアとアーキテクチャ
  • 電子工学および電気工学

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