An approach to realizing a two-step interconnection using a double-deck quartz mold based on ultraviolet nanoimprint lithography (UV-NIL) technology and Cu electroplating is discussed. The double-deck mold realizes a two-step simultaneous transcription and a two-step nanoscale interconnection. Nanoscale via and trench array patterns of Cu were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted via and trench patterns were simultaneously formed on a photocurable resin by the double-deck mold with a two-step structure. Using this mold, 73nm metal via and 190nm metal trench patterns were successfully fabricated by electroplating.
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