TY - JOUR
T1 - Copper multilayer interconnection using ultravaiolet nanoimprint lithography with a double-deck mold and electroplating
AU - Nagai, Noriyasu
AU - Ono, Hiroshi
AU - Sakuma, Katsuyuki
AU - Saito, Mikiko
AU - Mizuno, Jun
AU - Shoji, Shuichi
PY - 2009/12/1
Y1 - 2009/12/1
N2 - An approach to realizing a two-step interconnection using a double-deck quartz mold based on ultraviolet nanoimprint lithography (UV-NIL) technology and Cu electroplating is discussed. The double-deck mold realizes a two-step simultaneous transcription and a two-step nanoscale interconnection. Nanoscale via and trench array patterns of Cu were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted via and trench patterns were simultaneously formed on a photocurable resin by the double-deck mold with a two-step structure. Using this mold, 73nm metal via and 190nm metal trench patterns were successfully fabricated by electroplating.
AB - An approach to realizing a two-step interconnection using a double-deck quartz mold based on ultraviolet nanoimprint lithography (UV-NIL) technology and Cu electroplating is discussed. The double-deck mold realizes a two-step simultaneous transcription and a two-step nanoscale interconnection. Nanoscale via and trench array patterns of Cu were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted via and trench patterns were simultaneously formed on a photocurable resin by the double-deck mold with a two-step structure. Using this mold, 73nm metal via and 190nm metal trench patterns were successfully fabricated by electroplating.
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U2 - 10.1143/JJAP.48.115001
DO - 10.1143/JJAP.48.115001
M3 - Article
AN - SCOPUS:73849148739
VL - 48
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 11
M1 - 115001
ER -