Copper multilayer interconnection using ultravaiolet nanoimprint lithography with a double-deck mold and electroplating

Noriyasu Nagai*, Hiroshi Ono, Katsuyuki Sakuma, Mikiko Saito, Jun Mizuno, Shuichi Shoji

*この研究の対応する著者

研究成果: Article査読

6 被引用数 (Scopus)

抄録

An approach to realizing a two-step interconnection using a double-deck quartz mold based on ultraviolet nanoimprint lithography (UV-NIL) technology and Cu electroplating is discussed. The double-deck mold realizes a two-step simultaneous transcription and a two-step nanoscale interconnection. Nanoscale via and trench array patterns of Cu were formed on a silicon substrate using UV-NIL in combination with electroplating. Imprinted via and trench patterns were simultaneously formed on a photocurable resin by the double-deck mold with a two-step structure. Using this mold, 73nm metal via and 190nm metal trench patterns were successfully fabricated by electroplating.

本文言語English
論文番号115001
ジャーナルJapanese journal of applied physics
48
11
DOI
出版ステータスPublished - 2009 12月 1

ASJC Scopus subject areas

  • 工学(全般)
  • 物理学および天文学(全般)

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