Core-shell nanowire based electrical surface fastener used for room-temperature electronic packaging bonding

Peng Wang, Yang Ju*, Atsushi Hosoi

*この研究の対応する著者

研究成果: Article査読

6 被引用数 (Scopus)

抄録

With the ongoing miniaturization in electronic packaging, the traditional solders suffer from severe performance degradation. In addition, the high temperature required in the traditional solder reflow process may damage electronic elements. Therefore, there is an increasing urgent need for a new kind of nontoxic solder that can afford good mechanical stress and electrical contact at low temperature. This paper presents a method of fabricating nanowire surface fastener for the application of microelectronic packaging bonding at room temperature. This surface fastener consists of copper core and polystyrene shell nanowire arrays. It showed an adhesive strength of ~;24 N/cm2 and an electrical resistance of ~;0.41 × 10-2 Ω·cm2. This kind of nanowire surface fastener may enable the exploration of wide range applications, involving assembly of components in the electronic packaging.

本文言語English
ページ(範囲)503-507
ページ数5
ジャーナルElectronic Materials Letters
10
2
DOI
出版ステータスPublished - 2014 3月
外部発表はい

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料

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