Corporate-feed slotted waveguide array antenna in the 350-GHz band by silicon process

Karim Tekkouk, Jiro Hirokawa, Kazuki Oogimoto, Tadao Nagatsuma, Hiroyuki Seto, Yoshiyuki Inoue, Mikiko Saito

研究成果: Article査読

33 被引用数 (Scopus)

抄録

A corporate-feed slotted waveguide array antenna with broadband characteristics in terms of gain and reflection in the 350-GHz band is proposed. To improve the etching accuracy of the thin laminated plates with the conventional diffusion bonding process, a new fabrication process has been developed, where the etching accuracy is lower than ± 5μm. In this process, the laminated plates are made with silicon wafers and etched by deep reactive ion etcher process. These are gold plated then bonded with the diffusion bonding process. The estimated effective conductivity of the gold plated wafer is 1.6 × 107 S/m. The loss per unit length is 1.1 dB/cm. A 16 × 16 element array antenna has been designed and fabricated in the 350-GHz band with the proposed process. The broadband characteristic in terms of the antenna gain is demonstrated for the first time by measurement in this frequency band. The 3-dB down gain bandwidth is 50.8 GHz in simulation and is 44.6 GHz in measurement.

本文言語English
論文番号7750593
ページ(範囲)217-225
ページ数9
ジャーナルIEEE Transactions on Antennas and Propagation
65
1
DOI
出版ステータスPublished - 2017 1

ASJC Scopus subject areas

  • 電子工学および電気工学

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