Corporate-feed slotted wavguide array antenna at 350 GHz band by silicon process

Karim Tekkouk, Jiro Hirokawa, Kazuki Oogimoto, Tadao Nagatsuma, Hiroyuki Seto, Yoshiyuki Inoue, Mikiko Saito

研究成果: Conference contribution

2 被引用数 (Scopus)

抄録

A corporate feed slotted waveguide array antenna with broadband characteristics in term of gain in the 350 GHz band is achieved by measurement for the first time. The etching accuracy for thin laminated plates of the diffusion bonding process with conventional chemical etching is limited to ±20μm. This limits the use of this process for antenna fabrication in the submillimeter wave band where the fabrication tolerances are very severe. To improve the etching accuracy of the thin laminated plates, a new fabrication process has been developed. Each silicon wafer is etched by DRIE (deep reactive ion etcher) and is plated by gold on the surface. This new fabrication process provides better fabrication tolerances about ±5μ™ using wafer bond aligner. The thin laminated wafers are then bonded with the diffusion bonding process under high temperature and high pressure. To validate the proposed antenna concepts, four antenna prototypes have been designed and fabricated in the 350 GHz band. The 3dB-down gain bandwidth is about 35GHz by this silicon process while it was about 15GHz by the conventional process using metal plates in measurement.

本文言語English
ホスト出版物のタイトル2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ページ1197-1198
ページ数2
ISBN(電子版)9781509028863
DOI
出版ステータスPublished - 2016 10 25
イベント2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Fajardo, Puerto Rico
継続期間: 2016 6 262016 7 1

出版物シリーズ

名前2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016 - Proceedings

Other

Other2016 IEEE Antennas and Propagation Society International Symposium, APSURSI 2016
国/地域Puerto Rico
CityFajardo
Period16/6/2616/7/1

ASJC Scopus subject areas

  • 器械工学
  • 放射線
  • コンピュータ ネットワークおよび通信

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