TY - JOUR
T1 - Correlation between mechanical and dielectric relaxation processes in epoxy resin composites with nano- and micro-fillers
AU - Hyuga, Mayumi
AU - Tanaka, Toshikatsu
AU - Ohki, Yoshimichi
AU - Imai, Takahiro
AU - Harada, Miyuki
AU - Ochi, Mitsukazu
PY - 2012/9/1
Y1 - 2012/9/1
N2 - Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T g) decreased when a small content of nanoclay modified by octadecylamine was added, but the decrease in T g was suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T g increased when an abundant amount of microsilica was added. At temperatures above T g, both mechanical and dielectric relaxations were accelerated in samples with octadecylamine-modified nanoclay, while the acceleration did not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations were restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T g and low dielectric loss. ©2012 Wiley Periodicals, Inc. Electron Comm Jpn, 95(9): 1-9, 2012; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/ecj.11420
AB - Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T g) decreased when a small content of nanoclay modified by octadecylamine was added, but the decrease in T g was suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T g increased when an abundant amount of microsilica was added. At temperatures above T g, both mechanical and dielectric relaxations were accelerated in samples with octadecylamine-modified nanoclay, while the acceleration did not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations were restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T g and low dielectric loss. ©2012 Wiley Periodicals, Inc. Electron Comm Jpn, 95(9): 1-9, 2012; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/ecj.11420
KW - dielectric properties
KW - epoxy resin
KW - filler modifier.
KW - mechanical properties
KW - microcomposite
KW - polymer nanocomposite
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U2 - 10.1002/ecj.11420
DO - 10.1002/ecj.11420
M3 - Article
AN - SCOPUS:84865491712
VL - 95
SP - 1
EP - 9
JO - Electronics and Communications in Japan
JF - Electronics and Communications in Japan
SN - 1942-9533
IS - 9
ER -