Correlation between mechanical and dielectric relaxation processes in epoxy resin composites with nano- and micro-fillers

Mayumi Hyuga*, Toshikatsu Tanaka, Yoshimichi Ohki, Takahiro Imai, Miyuki Harada, Mitsukazu Ochi

*この研究の対応する著者

研究成果: Article査読

2 被引用数 (Scopus)

抄録

Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (T g) decreased when a small content of nanoclay modified by octadecylamine was added, but the decrease in T g was suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, T g increased when an abundant amount of microsilica was added. At temperatures above T g, both mechanical and dielectric relaxations were accelerated in samples with octadecylamine-modified nanoclay, while the acceleration did not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations were restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high T g and low dielectric loss. ©2012 Wiley Periodicals, Inc. Electron Comm Jpn, 95(9): 1-9, 2012; Published online in Wiley Online Library (wileyonlinelibrary.com). DOI 10.1002/ecj.11420

本文言語English
ページ(範囲)1-9
ページ数9
ジャーナルElectronics and Communications in Japan
95
9
DOI
出版ステータスPublished - 2012 9

ASJC Scopus subject areas

  • 信号処理
  • 物理学および天文学(全般)
  • コンピュータ ネットワークおよび通信
  • 電子工学および電気工学
  • 応用数学

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