TY - JOUR
T1 - Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution
AU - Yokoyama, Ken'ichi
AU - Nogami, Akihide
AU - Sakai, Jun'ichi
PY - 2014
Y1 - 2014
N2 - The surface crack nucleation of Sn-3.0Ag and Sn-0.5Cu solder alloys has been examined by performing sustained tensile-loading tests in 0.9 mass% NaCl solution at room temperature. For Sn-3.0Ag alloy, many cracks nucleate and propagate on the side surface of the specimen, similarly to Sn-3.0Ag-0.5Cu alloy reported previously. For Sn-0.5Cu alloy, such cracks are not observed, and ordinary creep deformation occurs in the solution. The effect of sustained applied stress, i.e., creep, on the dissolution of ions is smaller for Sn-0.5Cu alloy than for Sn-3.0Ag alloy. The present results suggest that there are differences in the susceptibility to cracking under applied stress in a solution, i.e., creep corrosion cracking, among lead-free solder alloys.
AB - The surface crack nucleation of Sn-3.0Ag and Sn-0.5Cu solder alloys has been examined by performing sustained tensile-loading tests in 0.9 mass% NaCl solution at room temperature. For Sn-3.0Ag alloy, many cracks nucleate and propagate on the side surface of the specimen, similarly to Sn-3.0Ag-0.5Cu alloy reported previously. For Sn-0.5Cu alloy, such cracks are not observed, and ordinary creep deformation occurs in the solution. The effect of sustained applied stress, i.e., creep, on the dissolution of ions is smaller for Sn-0.5Cu alloy than for Sn-3.0Ag alloy. The present results suggest that there are differences in the susceptibility to cracking under applied stress in a solution, i.e., creep corrosion cracking, among lead-free solder alloys.
KW - A. Electronic materials
KW - A. Tin
KW - B. SEM
KW - C. Intergranular corrosion
KW - C. Stress corrosion
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U2 - 10.1016/j.corsci.2014.05.004
DO - 10.1016/j.corsci.2014.05.004
M3 - Article
AN - SCOPUS:84903438097
VL - 86
SP - 142
EP - 148
JO - Corrosion Science
JF - Corrosion Science
SN - 0010-938X
ER -