Degradation in Dielectric Behavior of Soft Epoxy Resin by Concurrent Aging with Heat and Radiation

Hiroyuki Ishii, Hikaru Yamaguchi, Keigo Mori, Naoshi Hirai, Yoshimichi Ohki

研究成果: Conference contribution

抄録

The soft epoxy resin (SE) and the hard epoxy resin (HE) used in the nuclear power plants were simultaneously given heat and radiation. The glass transition temperature (Tg), indenter modulus (IM), and complex permittivity were measured. The difference in Tg between SE and HE is very significant, which exerts a great deal of influence on the degradation of SE and HE. While the IM and complex permittivity of HE are hardly affected by the degradation, SE becomes hard and its charge transport becomes less active.

本文言語English
ホスト出版物のタイトル2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ページ18-21
ページ数4
ISBN(電子版)9781728131214
DOI
出版ステータスPublished - 2019 10
イベント2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019 - Richland, United States
継続期間: 2019 10 202019 10 23

出版物シリーズ

名前Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
2019-October
ISSN(印刷版)0084-9162

Conference

Conference2019 IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2019
CountryUnited States
CityRichland
Period19/10/2019/10/23

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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