Deposition behavior of Ni on Si(100) surfaces in an aqueous alkaline solution

Daisuke Niwa*, Takayuki Homma, Tetsuya Osaka

*この研究の対応する著者

研究成果: Article査読

12 被引用数 (Scopus)

抄録

The spontaneous deposition of Ni on Si(100) surface in aqueous alkaline solution was investigated under various conditions. In a 0.1 M NiSO4 solution containing 0.2-0.5 M (NH4)2SO4, the optimum pH for the homogeneous deposition at 60-80°C at each set of operating conditions shifted in the high-pH direction as both (NH 4)2SO4 concentration and the operating temperature were decreased. The potential at which the deposition terminates and the deposition duration were determined from electrochemical open-circuit potential profiles. The different behaviors, observed at different pH levels, are discussed in terms of these potential measurements. Ultraviolet-visible absorption spectra of various Ni solutions used indicated that the deposition behavior was strongly affected by the composition of the Ni complex and the reactivity of Si surface. The deposition reaction efficiently proceeded when the Ni complex was present in a specific composition. The anodic reaction rate of Si decreased steeply when the solution temperature was lowered. The optimum condition for the homogeneous deposition was greatly affected by the reactivity of the Si surface rather man the composition of the complex, the higher pH favoring the overall reaction.

本文言語English
ページ(範囲)C54-C59
ジャーナルJournal of the Electrochemical Society
152
2
DOI
出版ステータスPublished - 2005 3 17

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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