With the use of a device simulator, we show that an ESD protection circuit whose junction filled with contacts is suited to a scaled STI process having thin n- junction with n+ being implanted from contact holes. We have confirmed by measurements that the protection has sufficient robustness.
|ジャーナル||IEEE Transactions on Electronics Packaging Manufacturing|
|出版物ステータス||Published - 2000 12 1|
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering