Design Optimization of Fin Shape of Heat Sinks for Enhanced Cooling Performance

Hikaru Igarashi*, Masanori Hirota, Makoto Yoshida, Tomoyuki Miyashita

*この研究の対応する著者

研究成果: Conference contribution

抄録

Heat sinks are well-known mechanisms aiding to dissipate heat efficiently. In this study, we designed and evaluated the cooling performance of heat sinks with diverse fin geometries, base materials, and fans. Also, we optimized the performance by using design optimization of the variables related to the shape of fins. Thus, by changing the fin geometries of the heat sink, adding trenches to the straight fins, and the related modifications, it was found that the optimized heat sink achieves a higher cooling performance than the (baseline) straight-fin heat sink. We also investigated the relationship between the depth of the trench and the cooling performance to find the optimal parameters.

本文言語English
ホスト出版物のタイトル2022 International Conference on Electronics Packaging, ICEP 2022
出版社Institute of Electrical and Electronics Engineers Inc.
ページ105-106
ページ数2
ISBN(電子版)9784991191138
DOI
出版ステータスPublished - 2022
イベント21st International Conference on Electronics Packaging, ICEP 2022 - Sapporo, Japan
継続期間: 2022 5月 112022 5月 14

出版物シリーズ

名前2022 International Conference on Electronics Packaging, ICEP 2022

Conference

Conference21st International Conference on Electronics Packaging, ICEP 2022
国/地域Japan
CitySapporo
Period22/5/1122/5/14

ASJC Scopus subject areas

  • プロセス化学およびプロセス工学
  • 電子工学および電気工学
  • 産業および生産工学
  • 電子材料、光学材料、および磁性材料

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