Design optimization of heat sink using additive manufacturing

Y. Tateishi, V. Parque, T. Miyashita, H. Gohara, R. Kato, Y. Ikeda

研究成果: Conference contribution

3 被引用数 (Scopus)

抄録

A new sink should be in simple shapes for reasonable manufacturing process. On the other hand, the heat sink tends to be complicated shape for high cooling performance. Recently, 3D printer is able to process complicated shapes. However, manufacturing cost by 3D printing method is expensive. Thus it is important to verify and improve fluid flow and thermal conductivity at the design stage of the heat sink. This study provides a simulation model and a new high performance heat sink by using finite element method and using optimization method. The new heat sink decreases the thermal resistance about 15% in comparison with the conventional one.

本文言語English
ホスト出版物のタイトル2017 IEEE CPMT Symposium Japan, ICSJ 2017
出版社Institute of Electrical and Electronics Engineers Inc.
ページ91-94
ページ数4
ISBN(電子版)9781538627129
DOI
出版ステータスPublished - 2017 12月 26
イベント2017 IEEE CPMT Symposium Japan, ICSJ 2017 - Kyoto, Japan
継続期間: 2017 11月 202017 11月 22

出版物シリーズ

名前2017 IEEE CPMT Symposium Japan, ICSJ 2017
2017-January

Other

Other2017 IEEE CPMT Symposium Japan, ICSJ 2017
国/地域Japan
CityKyoto
Period17/11/2017/11/22

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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