Detection of ion migration in composites for printed circuit boards by the pulsed electroacoustic method

M. Natsui*, Y. Echigo, T. Tanaka, Y. Ohki, T. Maeno

*この研究の対応する著者

研究成果: Paper査読

8 被引用数 (Scopus)

抄録

Pulsed electroacoustic (PEA) method is applied as a nondestructive technique to detect ion migration that progresses to the thickness direction in insulation composites for printed circuit boards. In both cases of a paper/phenol-resin composite and a glass/epoxy-resin composite, penetration of Cu migration into the bulk after aging was confirmed. Namely, a shift of the peak location of positive charge, which corresponds to the progress of migration in the aged composite, is observable by the PEA method.

本文言語English
ページ376-379
ページ数4
DOI
出版ステータスPublished - 2008 12 31
イベント2008 International Symposium on Electrical Insulating Materials, ISEIM 2008 - Yokkaichi, Japan
継続期間: 2008 9 72008 9 11

Conference

Conference2008 International Symposium on Electrical Insulating Materials, ISEIM 2008
国/地域Japan
CityYokkaichi
Period08/9/708/9/11

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料

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