Developing a leading practical application for 3D IC chip stacking technology: How to progress from fundamental technology to application technology

Masahiro Aoyagi, Fumito Imura, Fumiki Kato, Katsuya Kikuchi, Naoya Watanabe, Motohiro Suzuki, Hiroshi Nakagawa, Yoshikuni Okada, Tokihiko Yokoshima, Yasuhiro Yamaji, Shunsuke Nemoto, Tung Thanh Bui, Samson Melamed

研究成果: Article査読

1 被引用数 (Scopus)

抄録

3D IC chip stacking technology, which is a technology to vertically stack multiple IC chips such as CMOS, MEMS and power IC chips, is expected to be one of future electronic device integration technologies, because integration along the additional vertical dimension affords efficient use of space and innovation of system architecture. We developed fundamental technology of high density integration for 3D IC chip stacking. To accelerate industrial applications of this technology, a mass-production process was developed in collaboration with a manufacturing equipment company.

本文言語English
ジャーナルSynthesiology
9
1
DOI
出版ステータスPublished - 2016 6月 1

ASJC Scopus subject areas

  • 工学(全般)
  • 社会科学(全般)

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