@article{0540f8de62bc4ea6a2be2501f1a22bbe,
title = "Developing an application for 3D IC chip stacking technology: How to shift from fundamental to practical technology",
abstract = "3D IC chip stacking technology is expected to be the future of electronic device integration technology, because integration along the additional dimension affords efficient use of space and improvement of system architecture. We developed fundamental technology of high density integration for 3D IC chip stacking. To facilitate applications of this technology, a mass-production process was developed in collaboration with a production system company.",
keywords = "3D stacking, IC, Packaging, Semiconductor device, TSV",
author = "Masahiro Aoyagi and Fumito Imura and Fumiki Kato and Katsuya Kikuchi and Naoya Watanabe and Motohiro Suzuki and Hiroshi Nakagawa and Yoshikuni Okada and Tokihiko Yokoshima and Yasuhiro Yamaji and Shunsuke Nemoto and Tung, {Bui Thanh} and Melamed Samson",
note = "Publisher Copyright: {\textcopyright} 2016, Nat. Inst. of Adv. Industrial Science and Technology (AIST). All rights reserved.",
year = "2016",
month = mar,
day = "19",
doi = "10.5571/synth.9.1_1",
language = "English",
volume = "9",
pages = "1--14",
journal = "Synthesiology",
issn = "1883-0978",
publisher = "National Institute of Advanced Industrial Science and Technology (AIST)",
number = "1",
}