Developing an application for 3D IC chip stacking technology: How to shift from fundamental to practical technology

Masahiro Aoyagi*, Fumito Imura, Fumiki Kato, Katsuya Kikuchi, Naoya Watanabe, Motohiro Suzuki, Hiroshi Nakagawa, Yoshikuni Okada, Tokihiko Yokoshima, Yasuhiro Yamaji, Shunsuke Nemoto, Bui Thanh Tung, Melamed Samson

*この研究の対応する著者

研究成果: Article査読

2 被引用数 (Scopus)

抄録

3D IC chip stacking technology is expected to be the future of electronic device integration technology, because integration along the additional dimension affords efficient use of space and improvement of system architecture. We developed fundamental technology of high density integration for 3D IC chip stacking. To facilitate applications of this technology, a mass-production process was developed in collaboration with a production system company.

本文言語English
ページ(範囲)1-14
ページ数14
ジャーナルSynthesiology
9
1
DOI
出版ステータスPublished - 2016 3 19

ASJC Scopus subject areas

  • 工学(全般)
  • 社会科学(全般)

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