Development of lapping and polishing technologies of 4H-SiC wafers for power device applications

Hirokatsu Yashiro*, Tatsuo Fujimoto, Noboru Ohtani, Taizo Hoshino, Masakazu Katsuno, Takashi Aigo, Hiroshi Tsuge, Masashi Nakabayashi, Hosei Hirano, Kohei Tatsumi

*この研究の対応する著者

研究成果: Conference contribution

9 被引用数 (Scopus)

抄録

The development of lapping and polishing technologies for SiC single crystal wafers has realized the fabrication of an extremely flat SiC wafer with excellent surface quality. To improve the SiC wafer flatness, we developed a four-step lapping process consisting of four stages of both-side lapping with different grit-size abrasives. We have applied this process to lapping of 2-inch-diameter SiC wafers and obtained an excellent flatness with TTV (total thickness variation) of less than 3 μm, LTV (local thickness variation) of less than 1 μm, and SORI smaller than 10 μm. We also developed a novel MCP (mechano-chemical polishing) process for SiC wafers to obtain a damage-free smooth surface. During MCP, oxidizing agents added to colloidal silica slurry, such as NaOCl and H2O2, effectively oxidize the SiC wafer surface, and then the resulting oxides are removed by colloidal silica. AFM (atomic force microscope) observation of polished wafer surface revealed that this process allows us to have excellent surface smoothness as low as Ra=0.168 nm and RMS=0.2 nm.

本文言語English
ホスト出版物のタイトルSilicon Carbide and Related Materials 2007
編集者Akira Suzuki, Hajime Okumura, Kenji Fukuda, Shin-ichi Nishizawa, Tsunenobu Kimoto, Takashi Fuyuki
出版社Trans Tech Publications Ltd
ページ819-822
ページ数4
ISBN(印刷版)9780878493579
DOI
出版ステータスPublished - 2009 1月 1
外部発表はい
イベント12th International Conference on Silicon Carbide and Related Materials, ICSCRM 2007 - Otsu, Japan
継続期間: 2007 10月 142007 10月 19

出版物シリーズ

名前Materials Science Forum
600-603
ISSN(印刷版)0255-5476
ISSN(電子版)1662-9752

Conference

Conference12th International Conference on Silicon Carbide and Related Materials, ICSCRM 2007
国/地域Japan
CityOtsu
Period07/10/1407/10/19

ASJC Scopus subject areas

  • 材料科学(全般)
  • 凝縮系物理学
  • 材料力学
  • 機械工学

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