Development of lapping and polishing technologies of 4H-SiC wafers for power device applications
Hirokatsu Yashiro*, Tatsuo Fujimoto, Noboru Ohtani, Taizo Hoshino, Masakazu Katsuno, Takashi Aigo, Hiroshi Tsuge, Masashi Nakabayashi, Hosei Hirano, Kohei Tatsumi
*この研究の対応する著者
研究成果: Conference contribution
9
被引用数
(Scopus)