Development of new electrolytic and electroless gold plating processes for electronics applications

Tetsuya Osaka*, Yutaka Okinaka, Junji Sasano, Masaru Kato

*この研究の対応する著者

研究成果: Review article査読

35 被引用数 (Scopus)

抄録

This article reviews results of our investigations, performed over the period of a decade, on gold plating for electronics applications. Three different topics are covered: (1) development of a new, non-cyanide, soft-gold electroplating bath containing both thiosulfate and sulfite as ligands; (2) evaluation of a known cyanide-based, substrate-catalyzed electroless bath for depositing pure soft gold, and subsequent development of an alternative, non-cyanide, substrate-catalyzed bath; and (3) development of a new process to electroplate amorphous hard-gold alloys for probable future applications as a contact material on nano-scale electronic devices.

本文言語English
ページ(範囲)425-437
ページ数13
ジャーナルScience and Technology of Advanced Materials
7
5
DOI
出版ステータスPublished - 2006 7

ASJC Scopus subject areas

  • 材料科学(全般)

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