@inproceedings{fd757ba4c2b24d4fa19eddfce1ab82c6,
title = "Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application",
abstract = "Aiming for application to the inverter system of HEV and EV, we have developed a novel packaging technique for SiC power devices based on Nickel Micro Plating Bonding (NMPB) technique. We implemented heat resistant mounting of SiC schottky barrier diode (SBD) on the TO247 type package and confirmed the rectifying behavior even after the high temperature storage for 500hr at 250°C without any significant degradations. We also fabricated one-leg inverter modules mounting SBDs and MOSFETs using newly designed lead frames for NMPB process. The module showed normal rectifying and switching behavior even at high temperature such as about 250°C.",
keywords = "EV, HEV, Inverter, Lead frame, MOSFET, Module, Nickel, Plating, SBD, SiC",
author = "Kohei Tatsumi and Masakazu Inagaki and Kazuhito Kamei and Tomonori Iizuka and Hiroaki Narimatsu and Nobuaki Sato and Koji Shimizu and Kazutoshi Ueda and Akihiro Imakire and Masayuki Hikita and Rikiya Kamimura and Kazuhiko Sugiura and Kazuhiro Tsuruta and Keiji Toda",
note = "Funding Information: This work was supported by the Council for Science, Technology and Innovation (CSTI), Cross-ministerial Strategic Innovation Promotion Program (SIP), and “Next-generation power electronics/ Research and development of packaging technology for high temperature resistant SiC module of hybrid automobile of next-generation SiC power electronics” (funding agency: NEDO) We acknowledge greatly to Tsukuba Power Electronics Constellations (TPEC) for their generous supply of SiC devices. Publisher Copyright: {\textcopyright} 2017 IEEE.; 67th IEEE Electronic Components and Technology Conference, ECTC 2017 ; Conference date: 30-05-2017 Through 02-06-2017",
year = "2017",
month = aug,
day = "1",
doi = "10.1109/ECTC.2017.103",
language = "English",
series = "Proceedings - Electronic Components and Technology Conference",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1316--1321",
booktitle = "Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017",
}