Development of Packaging Technology for High Temperature Resistant SiC Module of Automobile Application

Kohei Tatsumi, Masakazu Inagaki, Kazuhito Kamei, Tomonori Iizuka, Hiroaki Narimatsu, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Akihiro Imakire, Masayuki Hikita, Rikiya Kamimura, Kazuhiko Sugiura, Kazuhiro Tsuruta, Keiji Toda