Wire bonding technology that can produce more compact and higher density chips without modifying the existing assembly process is desired. This paper discusses reduction of the diameter of ball to be performed at the tip of the wire, the required wire diameter reduction, capillary tip diameter reduction, and attainment of a higher Young's modulus for the wire that can suppress wire sweep in transfer molding. It also indicates that wire bonding for a pitch of 70μm or less can be performed with no problem in reliability of the bonded zone.
|出版ステータス||Published - 1995 12 1|
|イベント||Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA|
継続期間: 1995 10 2 → 1995 10 4
|Other||Proceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium|
|City||Austin, TX, USA|
|Period||95/10/2 → 95/10/4|
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