Development of ultra-fine pitch ball bonding technology

Kohei Tatsumi*, Tomohiro Uno, Osamu Kitamura, Yasuhide Ohno, Takashi Katsumata, Masayuki Furusawa

*この研究の対応する著者

研究成果査読

12 被引用数 (Scopus)

抄録

Wire bonding technology that can produce more compact and higher density chips without modifying the existing assembly process is desired. This paper discusses reduction of the diameter of ball to be performed at the tip of the wire, the required wire diameter reduction, capillary tip diameter reduction, and attainment of a higher Young's modulus for the wire that can suppress wire sweep in transfer molding. It also indicates that wire bonding for a pitch of 70μm or less can be performed with no problem in reliability of the bonded zone.

本文言語English
ページ295-298
ページ数4
出版ステータスPublished - 1995 12 1
外部発表はい
イベントProceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium - Austin, TX, USA
継続期間: 1995 10 21995 10 4

Other

OtherProceedings of the 17th IEEE/CPMT International Electronics Manufacturing Technology Symposium
CityAustin, TX, USA
Period95/10/295/10/4

ASJC Scopus subject areas

  • 産業および生産工学
  • 電子工学および電気工学

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