Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces

T. Tanaka, Tomonori Iizuka, Yoshimichi Ohki, X. Huang, P. Jiang

研究成果: Conference contribution

4 引用 (Scopus)

抄録

Epoxy/AlN composites were prepared using high purity AlN particles with an average size of 1.1 μm. AlN particles were surface-treated with three kinds of silane coupling agents and three kinds of surface-modifiers. Dielectric properties and thermal conductivity were evaluated. As a result, it was found that silane coupling agents with epoxy, mercapto, and amino groups create higher thermal conductivity than surface modifiers such as GO, POSS and hyper-branched polymer. A silane coupling agent with mercapto group and a graphene oxide surface modifier are promising at high and low loading levels, respectively. From the dielectric spectroscopy study, it can be said that interfacial conditions should be improved by finding out proper methods.

元の言語English
ホスト出版物のタイトルProceedings of IEEE International Conference on Solid Dielectrics, ICSD
ページ377-380
ページ数4
DOI
出版物ステータスPublished - 2013
イベントICSD 2013 - Proceedings of the 2013 IEEE International Conference on Solid Dielectrics - Bologna
継続期間: 2013 6 302013 7 4

Other

OtherICSD 2013 - Proceedings of the 2013 IEEE International Conference on Solid Dielectrics
Bologna
期間13/6/3013/7/4

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fillers
Silanes
Dielectric properties
Fillers
dielectric properties
Thermal conductivity
Coupling agents
thermal conductivity
silanes
conductivity
composite materials
Composite materials
matrices
Dielectric spectroscopy
Graphite
Oxides
Graphene
graphene
Polymers
purity

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Condensed Matter Physics

これを引用

Tanaka, T., Iizuka, T., Ohki, Y., Huang, X., & Jiang, P. (2013). Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces. : Proceedings of IEEE International Conference on Solid Dielectrics, ICSD (pp. 377-380). [6619742] https://doi.org/10.1109/ICSD.2013.6619742

Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces. / Tanaka, T.; Iizuka, Tomonori; Ohki, Yoshimichi; Huang, X.; Jiang, P.

Proceedings of IEEE International Conference on Solid Dielectrics, ICSD. 2013. p. 377-380 6619742.

研究成果: Conference contribution

Tanaka, T, Iizuka, T, Ohki, Y, Huang, X & Jiang, P 2013, Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces. : Proceedings of IEEE International Conference on Solid Dielectrics, ICSD., 6619742, pp. 377-380, ICSD 2013 - Proceedings of the 2013 IEEE International Conference on Solid Dielectrics, Bologna, 13/6/30. https://doi.org/10.1109/ICSD.2013.6619742
Tanaka T, Iizuka T, Ohki Y, Huang X, Jiang P. Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces. : Proceedings of IEEE International Conference on Solid Dielectrics, ICSD. 2013. p. 377-380. 6619742 https://doi.org/10.1109/ICSD.2013.6619742
Tanaka, T. ; Iizuka, Tomonori ; Ohki, Yoshimichi ; Huang, X. ; Jiang, P. / Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces. Proceedings of IEEE International Conference on Solid Dielectrics, ICSD. 2013. pp. 377-380
@inproceedings{d6f5e95fbd714888b053c56206807a13,
title = "Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces",
abstract = "Epoxy/AlN composites were prepared using high purity AlN particles with an average size of 1.1 μm. AlN particles were surface-treated with three kinds of silane coupling agents and three kinds of surface-modifiers. Dielectric properties and thermal conductivity were evaluated. As a result, it was found that silane coupling agents with epoxy, mercapto, and amino groups create higher thermal conductivity than surface modifiers such as GO, POSS and hyper-branched polymer. A silane coupling agent with mercapto group and a graphene oxide surface modifier are promising at high and low loading levels, respectively. From the dielectric spectroscopy study, it can be said that interfacial conditions should be improved by finding out proper methods.",
keywords = "coupling agents, high thermal conductivity, interfaces, multifunctional materials, polymer composites",
author = "T. Tanaka and Tomonori Iizuka and Yoshimichi Ohki and X. Huang and P. Jiang",
year = "2013",
doi = "10.1109/ICSD.2013.6619742",
language = "English",
isbn = "9781479908073",
pages = "377--380",
booktitle = "Proceedings of IEEE International Conference on Solid Dielectrics, ICSD",

}

TY - GEN

T1 - Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces

AU - Tanaka, T.

AU - Iizuka, Tomonori

AU - Ohki, Yoshimichi

AU - Huang, X.

AU - Jiang, P.

PY - 2013

Y1 - 2013

N2 - Epoxy/AlN composites were prepared using high purity AlN particles with an average size of 1.1 μm. AlN particles were surface-treated with three kinds of silane coupling agents and three kinds of surface-modifiers. Dielectric properties and thermal conductivity were evaluated. As a result, it was found that silane coupling agents with epoxy, mercapto, and amino groups create higher thermal conductivity than surface modifiers such as GO, POSS and hyper-branched polymer. A silane coupling agent with mercapto group and a graphene oxide surface modifier are promising at high and low loading levels, respectively. From the dielectric spectroscopy study, it can be said that interfacial conditions should be improved by finding out proper methods.

AB - Epoxy/AlN composites were prepared using high purity AlN particles with an average size of 1.1 μm. AlN particles were surface-treated with three kinds of silane coupling agents and three kinds of surface-modifiers. Dielectric properties and thermal conductivity were evaluated. As a result, it was found that silane coupling agents with epoxy, mercapto, and amino groups create higher thermal conductivity than surface modifiers such as GO, POSS and hyper-branched polymer. A silane coupling agent with mercapto group and a graphene oxide surface modifier are promising at high and low loading levels, respectively. From the dielectric spectroscopy study, it can be said that interfacial conditions should be improved by finding out proper methods.

KW - coupling agents

KW - high thermal conductivity

KW - interfaces

KW - multifunctional materials

KW - polymer composites

UR - http://www.scopus.com/inward/record.url?scp=84891605304&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84891605304&partnerID=8YFLogxK

U2 - 10.1109/ICSD.2013.6619742

DO - 10.1109/ICSD.2013.6619742

M3 - Conference contribution

AN - SCOPUS:84891605304

SN - 9781479908073

SP - 377

EP - 380

BT - Proceedings of IEEE International Conference on Solid Dielectrics, ICSD

ER -