Dielectric properties and thermal conductivity of epoxy/AlN composites with several kinds of filler-matrix interfaces

T. Tanaka, T. Iizuka, Y. Ohki, X. Huang, P. Jiang

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

Epoxy/AlN composites were prepared using high purity AlN particles with an average size of 1.1 μm. AlN particles were surface-treated with three kinds of silane coupling agents and three kinds of surface-modifiers. Dielectric properties and thermal conductivity were evaluated. As a result, it was found that silane coupling agents with epoxy, mercapto, and amino groups create higher thermal conductivity than surface modifiers such as GO, POSS and hyper-branched polymer. A silane coupling agent with mercapto group and a graphene oxide surface modifier are promising at high and low loading levels, respectively. From the dielectric spectroscopy study, it can be said that interfacial conditions should be improved by finding out proper methods.

本文言語English
ホスト出版物のタイトルICSD 2013 - Proceedings of the 2013 IEEE International Conference on Solid Dielectrics
ページ377-380
ページ数4
DOI
出版ステータスPublished - 2013 12月 1
イベントICSD 2013 - Proceedings of the 2013 IEEE International Conference on Solid Dielectrics - Bologna, Italy
継続期間: 2013 6月 302013 7月 4

出版物シリーズ

名前Proceedings of IEEE International Conference on Solid Dielectrics, ICSD
ISSN(印刷版)1553-5282
ISSN(電子版)2159-1687

Other

OtherICSD 2013 - Proceedings of the 2013 IEEE International Conference on Solid Dielectrics
国/地域Italy
CityBologna
Period13/6/3013/7/4

ASJC Scopus subject areas

  • 電子工学および電気工学
  • 電子材料、光学材料、および磁性材料
  • 材料化学
  • 凝縮系物理学

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