Dielectric properties of polymer blend of polypropylene and polyethylene

K. Katsunami, K. Ishii, Y. Tanaka, Y. Ohki

研究成果: Conference contribution

3 引用 (Scopus)

抜粋

Space-charge-formation characteristics in polyethylene, polypropylene, and their blends are discussed based on the results of DC conduction, thermal pulse current, and thermally stimulated current. Negative space charge is formed throughout the bulk of polypropylene, while positive space charge is formed in polyethylene. In polymer blends of the two homopolymers, the amount of negative space charge increases with an increase in polypropylene content, while that of positive space charge increases with an increase in polyethylene content. It appears that space charges of both polarities are formed in the polymer blends, presumably with a tendency for the charges to be trapped in their respective preferential polymers. By blending the two homopolymers, DC conduction current becomes larger than that of homopolymers. The dielectric strength at low temperature which is electronic in nature decreases by blending. The dielectric strength at room temperature which is governed by a thermal process increases by blending the two homopolymers, because the spherulite boundaries of polypropylene are reinforced to improve the mechanical properties.

元の言語English
ホスト出版物のタイトルProc 3 Int Conf Prop Appl Dielectr Mater
出版者Publ by IEEE
ページ999-1002
ページ数4
ISBN(印刷物)0879425687
出版物ステータスPublished - 1991 12 1
外部発表Yes
イベントProceedings of the 3rd International Conference on Properties and Applications of Dielectric Materials - Tokyo, Jpn
継続期間: 1991 7 81991 7 12

出版物シリーズ

名前Proc 3 Int Conf Prop Appl Dielectr Mater

Other

OtherProceedings of the 3rd International Conference on Properties and Applications of Dielectric Materials
Tokyo, Jpn
期間91/7/891/7/12

ASJC Scopus subject areas

  • Engineering(all)

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  • これを引用

    Katsunami, K., Ishii, K., Tanaka, Y., & Ohki, Y. (1991). Dielectric properties of polymer blend of polypropylene and polyethylene. : Proc 3 Int Conf Prop Appl Dielectr Mater (pp. 999-1002). (Proc 3 Int Conf Prop Appl Dielectr Mater). Publ by IEEE.