Direct gold bonding for flexible integrated electronics

Masahito Takakuwa, Kenjiro Fukuda*, Tomoyuki Yokota, Daishi Inoue, Daisuke Hashizume, Shinjiro Umezu, Takao Someya

*この研究の対応する著者

研究成果: Article査読

1 被引用数 (Scopus)

抄録

Flexible and stable interconnections are critical for the next generation of shape-conformable and wearable electronics. These interconnections should have metal-like conductivity and sufficiently low stiffness that does not compromise the flexibility of the device; moreover, they must be achieved using low-temperature processes to prevent device damage. However, conventional interconnection bonding methods require additional adhesive layers, making it challenging to achieve these characteristics simultaneously. Here, we develop and characterize water vapor plasma-assisted bonding (WVPAB) that enables direct bonding of gold electrodes deposited on ultrathin polymer films. WVPAB bonds rough gold electrodes at room temperature and atmospheric pressure in ambient air. Hydroxyl groups generated by the plasma assist bonding between two gold surfaces, allowing the formation of a strong and stable interface. The applicability of WVPAB-mediated connections to ultrathin electronic systems was also demonstrated, and ultraflexible organic photovoltaics and light-emitting diodes fabricated on separate films were successfully interconnected via ultrathin wiring films.

本文言語English
論文番号eabl6228
ジャーナルScience Advances
7
52
DOI
出版ステータスPublished - 2021 12月

ASJC Scopus subject areas

  • 一般

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