Effect of Au nanoporous structure on bonding strength

Kaori Matsunaga, Min Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

研究成果: Conference contribution

1 被引用数 (Scopus)

抄録

Recently, several materials and joining processes have been proposed as alternatives to high-Pb-containing solders. There has been an increasing focus on developing solid-state bonding interconnection processes based on sintering, such as bonding techniques using Ag or Cu nanoparticles. However, sintered nanoparticle layers tend to have voids that result from solvent residue and dispersing agents. The voids in the sintered layer degrade the reliability of the joints. Therefore, we have proposed a solid-state bonding technique without solvents and flux using a nanoporous sheet. A nanoporous sheet can be made from binary alloy systems by dissolving the less noble component from the alloy selectively. A bonding technique using nanomaterials could reduce the bonding temperature because of the high reactive nanoporous surface. In this study, Au nanoporous sheets were fabricated by dealloying a Au-Ag alloy into an HNO<inf>3</inf> solution, and the effects of the Au nanoporous structure on joint bonding strength were investigated. After dealloying, Au nanoporous sheets were set between bare Cu substrates. The samples were bonded at various process temperatures under a nitrogen atmosphere. As a result, the joint bonded at 300 °C, using the Au nanoporous sheet with a dealloying time of 1 h, showed a high shear strength of about 20 MPa. It was found that joining using Au nanoporous bonding was successfully achieved.

本文言語English
ホスト出版物のタイトルICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
出版社Institute of Electrical and Electronics Engineers Inc.
ページ830-833
ページ数4
ISBN(印刷版)9784904090138
DOI
出版ステータスPublished - 2015 5 20
イベント2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
継続期間: 2015 4 142015 4 17

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
国/地域Japan
CityKyoto
Period15/4/1415/4/17

ASJC Scopus subject areas

  • 電子工学および電気工学

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