Effect of Au nanoporous structure on bonding strength

Kaori Matsunaga, Min Su Kim, Hiroshi Nishikawa, Mikiko Saito, Jun Mizuno

研究成果: Conference contribution

1 引用 (Scopus)

抄録

Recently, several materials and joining processes have been proposed as alternatives to high-Pb-containing solders. There has been an increasing focus on developing solid-state bonding interconnection processes based on sintering, such as bonding techniques using Ag or Cu nanoparticles. However, sintered nanoparticle layers tend to have voids that result from solvent residue and dispersing agents. The voids in the sintered layer degrade the reliability of the joints. Therefore, we have proposed a solid-state bonding technique without solvents and flux using a nanoporous sheet. A nanoporous sheet can be made from binary alloy systems by dissolving the less noble component from the alloy selectively. A bonding technique using nanomaterials could reduce the bonding temperature because of the high reactive nanoporous surface. In this study, Au nanoporous sheets were fabricated by dealloying a Au-Ag alloy into an HNO<inf>3</inf> solution, and the effects of the Au nanoporous structure on joint bonding strength were investigated. After dealloying, Au nanoporous sheets were set between bare Cu substrates. The samples were bonded at various process temperatures under a nitrogen atmosphere. As a result, the joint bonded at 300 °C, using the Au nanoporous sheet with a dealloying time of 1 h, showed a high shear strength of about 20 MPa. It was found that joining using Au nanoporous bonding was successfully achieved.

元の言語English
ホスト出版物のタイトルICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference
出版者Institute of Electrical and Electronics Engineers Inc.
ページ830-833
ページ数4
ISBN(印刷物)9784904090138
DOI
出版物ステータスPublished - 2015 5 20
イベント2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015 - Kyoto, Japan
継続期間: 2015 4 142015 4 17

Other

Other2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015
Japan
Kyoto
期間15/4/1415/4/17

Fingerprint

Joining
Nanoparticles
Binary alloys
Nanostructured materials
Shear strength
Soldering alloys
Sintering
Fluxes
Nitrogen
Temperature
Substrates

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

これを引用

Matsunaga, K., Kim, M. S., Nishikawa, H., Saito, M., & Mizuno, J. (2015). Effect of Au nanoporous structure on bonding strength. : ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (pp. 830-833). [7111127] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP-IAAC.2015.7111127

Effect of Au nanoporous structure on bonding strength. / Matsunaga, Kaori; Kim, Min Su; Nishikawa, Hiroshi; Saito, Mikiko; Mizuno, Jun.

ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., 2015. p. 830-833 7111127.

研究成果: Conference contribution

Matsunaga, K, Kim, MS, Nishikawa, H, Saito, M & Mizuno, J 2015, Effect of Au nanoporous structure on bonding strength. : ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference., 7111127, Institute of Electrical and Electronics Engineers Inc., pp. 830-833, 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference, ICEP-IAAC 2015, Kyoto, Japan, 15/4/14. https://doi.org/10.1109/ICEP-IAAC.2015.7111127
Matsunaga K, Kim MS, Nishikawa H, Saito M, Mizuno J. Effect of Au nanoporous structure on bonding strength. : ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc. 2015. p. 830-833. 7111127 https://doi.org/10.1109/ICEP-IAAC.2015.7111127
Matsunaga, Kaori ; Kim, Min Su ; Nishikawa, Hiroshi ; Saito, Mikiko ; Mizuno, Jun. / Effect of Au nanoporous structure on bonding strength. ICEP-IAAC 2015 - 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 830-833
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