抄録
Copper films electrodeposited from acid sulfate baths containing conventional additives used in the damascene process for the fabrication of ultralarge-scale integration interconnects were analyzed quantitatively to investigate the relation between carbon content and electrical resistivity of the deposit. In the as-deposited state, the resistivity of deposits that did not exhibit self-annealing effects in scanning ion microscope examination increased almost linearly with carbon content in the range of 0.002-0.045 wt %. The deposits that exhibited self-annealing effects showed higher resistivity values at identical carbon contents. After self-annealing, resistivity values of all deposits varied almost linearly with carbon content.
| 本文言語 | English |
|---|---|
| ページ（範囲） | D15-D17 |
| ジャーナル | Electrochemical and Solid-State Letters |
| 巻 | 12 |
| 号 | 3 |
| DOI | |
| 出版ステータス | Published - 2009 1月 19 |
ASJC Scopus subject areas
- 化学工学（全般）
- 材料科学（全般）
- 物理化学および理論化学
- 電気化学
- 電子工学および電気工学