Effect of Heat-Treatment on the Structure and Resistivity of Electroless Ni-W-P Alloy Films

Lchiro Koiwa, Masahiko Usuda, Tetsuya Osaka

研究成果: Article査読

46 被引用数 (Scopus)

抄録

An electroless plating bath for amorphous Ni-W-P alloy films was developed and their heat change properties were investigated from the viewpoint of W codeposition effect. The alloy films kept amorphous state with increasing W content even though the P content decreased. Moreover, the films became more amorphous, and their thermal stability increased with an increase of W content in the deposit. The tungsten content was varied from 0 to 20.8 weight percent (w/o) with a decrease in P content from 14.0 to 6.2 w/o by increasing the Na2WO4concentration in the bath. Two characteristic heat change behaviors were observed in the Ni-W-P alloy films. One was the formation of metastable phase in spite of low P content. The other was direct formation of Ni-W alloy phase. The tungsten codeposition increased the thermal stability of amorphous Ni-W-P alloy films plated from the baths with higher Na2WO4 concentration by suppressing the Ni crystallization prior to the Ni3P compound formation. The thermal changes of resistivity strongly depended on the crystallization of the Ni3P compound and Ni alloy phase. Both crystallization reactions were controlled by the P and W contents in the deposits.

本文言語English
ページ(範囲)1222-1228
ページ数7
ジャーナルJournal of the Electrochemical Society
135
5
DOI
出版ステータスPublished - 1988 5

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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