Effect of isothermal aging at 250°C on shear strength of joints using Au nanoporous bonding for die attach

H. Nishikawa, K. Matsunaga, M. S. Kim, M. Saito, J. Mizuno

研究成果: Paper査読

抄録

High-Temperature joining is a key technology for electronic component assembly and other high-Temperature applications. Recently, focusing on the sintering behavior of metal particles, the joining process using a nanoparticle paste has been proposed as an alternative to establish a high-Temperature joining technology. In this study, a feasibility study has been conducted to determine whether an Au nanoporous sheet can be used for joint material. We evaluated the effect of isothermal aging at 250 °C on shear strength of joints using an Au nanoporous sheet. The shear strength of the joint after isothermal storage at 250 °C for 1000h was more than 25 MPa.

本文言語English
DOI
出版ステータスPublished - 2016
イベントIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016 - Albuquerque, United States
継続期間: 2016 5 102016 5 12

Conference

ConferenceIMAPS International Conference and Exhibition on High Temperature Electronics, HiTEC 2016
国/地域United States
CityAlbuquerque
Period16/5/1016/5/12

ASJC Scopus subject areas

  • 電子工学および電気工学

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