Effect of Tl-codeposition on Au electrodeposition from non-cyanide bath

M. Saito*, K. Inoue, K. Shiokawa, T. Homma

*この研究の対応する著者

研究成果: Conference contribution

8 被引用数 (Scopus)

抄録

Effect of Tl on the electrodeposition behavior of Au was investigated by electrochemical analysis, total-reflection X-ray fluorescene analysis, XRD, glow discharge optical emission spectrometer (GD-OES) and hardness measurement. The deposition rate increased with an increase in the amount of Tl addition to the bath. Tl was co-deposited at the interface between the seed layer and the Au films, as well as in the films. In asdeposited condition, the Tl contained films exhibited higher hardness compared with the Tl-free films, while both of them showed almost the same hardness after annealing. It was suggested that the hardness is correlated with the crystal orientation of the grains.

本文言語English
ホスト出版物のタイトルFundamentals of Electrochemical Growth
ホスト出版物のサブタイトルFrom UPD to Microstructures - Symposium in Memory of Prof. Evgeni Budevski
出版社Electrochemical Society Inc.
ページ87-96
ページ数10
34
ISBN(電子版)9781566778084
ISBN(印刷版)9781566778084
DOI
出版ステータスPublished - 2009

出版物シリーズ

名前ECS Transactions
番号34
25
ISSN(印刷版)1938-5862
ISSN(電子版)1938-6737

ASJC Scopus subject areas

  • 工学(全般)

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