Effects of additives on copper electrodeposition in submicrometer trenches

Madoka Hasegawa*, Yoshinori Negishi, Takuya Nakanishi, Tetsuya Osaka

*この研究の対応する著者

研究成果: Article査読

96 被引用数 (Scopus)

抄録

Effects of the conventional bath additives [chloride ions (Cl-), poly(ethylene glycol) (PEG), bis(3-sulfopropyl)disulfide (SPS), and Janus green B (JGB)] used in the damascene process on the filling of submicrometer trenches with electrodeposited copper were investigated by electrochemical polarization measurement and cross-sectional microscopy. The combination of Cl- and PEG inhibited copper deposition in the areas of opening of the trenches, while SPS accelerated it at the bottom. Polarization curves showed that the degree of acceleration of copper deposition by SPS increases with the concentration of SPS. This SPS concentration-dependent acceleration accounts for the observed bottom-up growth. The addition of JGB inhibited copper deposition at the later stages of the filling process, leading to the suppression of the overfill phenomenon, although the bottom-up growth was also inhibited at high JGB concentrations. Bath agitation significantly enhanced the inhibition effect of JGB on the overfill phenomenon, without disturbing the bottom-up growth.

本文言語English
ページ(範囲)C221-C228
ジャーナルJournal of the Electrochemical Society
152
4
DOI
出版ステータスPublished - 2005

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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