Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites

N. Tagami, M. Okada, Naoshi Hirai, T. Tanaka, Yoshimichi Ohki, T. Imai, M. Harada, M. Ochi

研究成果: Conference contribution

6 引用 (Scopus)

抄録

Effects of the differences in the curing agent and filler dispersion method on the dielectric properties were examined for epoxy/clay nanocomposites. Measurements of permittivity, conductivity, and space charge distribution suggest that the curing agent gives a strong effect and the presence of nanofillers affects secondly, while the filler dispersion method gives a weak effect.

元の言語English
ホスト出版物のタイトルAnnual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
ページ232-235
ページ数4
DOI
出版物ステータスPublished - 2007
イベント2007 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP - Vancouver, BC, Canada
継続期間: 2007 10 142007 10 19

Other

Other2007 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP
Canada
Vancouver, BC
期間07/10/1407/10/19

Fingerprint

Dielectric properties
Curing
Fillers
Nanocomposites
Charge distribution
Electric space charge
Clay
Permittivity
clay

ASJC Scopus subject areas

  • Engineering(all)
  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

これを引用

Tagami, N., Okada, M., Hirai, N., Tanaka, T., Ohki, Y., Imai, T., ... Ochi, M. (2007). Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites. : Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP (pp. 232-235). [4451465] https://doi.org/10.1109/CEIDP.2007.4451465

Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites. / Tagami, N.; Okada, M.; Hirai, Naoshi; Tanaka, T.; Ohki, Yoshimichi; Imai, T.; Harada, M.; Ochi, M.

Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2007. p. 232-235 4451465.

研究成果: Conference contribution

Tagami, N, Okada, M, Hirai, N, Tanaka, T, Ohki, Y, Imai, T, Harada, M & Ochi, M 2007, Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites. : Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP., 4451465, pp. 232-235, 2007 Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP, Vancouver, BC, Canada, 07/10/14. https://doi.org/10.1109/CEIDP.2007.4451465
Tagami N, Okada M, Hirai N, Tanaka T, Ohki Y, Imai T その他. Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites. : Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2007. p. 232-235. 4451465 https://doi.org/10.1109/CEIDP.2007.4451465
Tagami, N. ; Okada, M. ; Hirai, Naoshi ; Tanaka, T. ; Ohki, Yoshimichi ; Imai, T. ; Harada, M. ; Ochi, M. / Effects of curing and filler dispersion methods on dielectric properties of epoxy nanocomposites. Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP. 2007. pp. 232-235
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