Effects of excimer irradiation treatment on thermocompression Au-Au bonding

Naoko Unami*, Katsuyuki Sakuma, Jun Mizuno, Shuichi Shoji

*この研究の対応する著者

研究成果: Article査読

14 被引用数 (Scopus)

抄録

We studied the feasibility of using vacuum ultraviolet (VUV) treatment as a surface improvement technique with Au-Au flip-chip bonding. For finepitch electrical interconnections in three-dimensional (3D) stack applications, robust and reliable bonding is desirable; in this case, surface modification treatment is needed before the bonding process. A VUV surface treatment was used to remove organic contaminants. Samples of electroplated Au pads were examined by X-ray photoelectron spectroscopy (XPS) to evaluate the chemical composition of the Au surfaces. The XPS results revealed that the carbon-based contaminants on the surface were removed by the VUV treatment. The shear strength of the bonded sample was also improved. The average shear strength of a bump with VUV treatment is 1.6 times larger than that of a bump without VUV treatment. Cross-sectional scanning electron microscopy (SEM) images of the bonded samples confirmed the absence of voids and cracks. The results show that VUV treatment has clear effects on Au-Au flip-chip bonding.

本文言語English
ページ(範囲)06GN121-06GN124
ジャーナルJapanese journal of applied physics
49
6 PART 2
DOI
出版ステータスPublished - 2010 6月

ASJC Scopus subject areas

  • 工学(全般)
  • 物理学および天文学(全般)

フィンガープリント

「Effects of excimer irradiation treatment on thermocompression Au-Au bonding」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル