Effects of impurities on resistivity of electrodeposited high-B s CoNiFe-based soft magnetic thin films

Tetsuya Osaka*, Tokihiko Yokoshima, Takuya Nakanishi

*この研究の対応する著者

研究成果: Conference article査読

14 被引用数 (Scopus)

抄録

Controlling the very small amount of inclusion of impurity elements by addition to the plating bath of various organic additives was found to be very effective in developing electrodeposited high-B s CoNiFe soft magnetic thin films with desirably high resistivity. Included impurities were suggested to cause not only electron scattering but also decreasing grain size, both of which led to an increase of the resistivity. Chemical state of impurities was indicated to be controllable by selection of additives based on the functional group for adsorption.

本文言語English
ページ(範囲)1761-1763
ページ数3
ジャーナルIEEE Transactions on Magnetics
37
4 I
DOI
出版ステータスPublished - 2001 7
イベント8th Joint Magnetism and Magnetic Materials -International Magnetic Conference- (MMM-Intermag) - San Antonio, TX, United States
継続期間: 2001 1 72001 1 11

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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