Effects of saccharin and thiourea on sulfur inclusion and coercivity of electroplated soft magnetic CoNiFe film

Tetsuya Osaka, Takahiro Sawaguchi, Fumio Mizutani, Tokihiko Yokoshima, Madoka Takai, Yutaka Okinaka

研究成果: Article査読

115 被引用数 (Scopus)

抄録

During the course of our recent work performed to develop an electroplated CoNiFe ternary alloy with high saturation magnetic flux density and low coercivity for use in magnetic recording heads, it was observed that two common sulfur-containing additives, saccharin and thiourea, behave differently with respect to the dependence of sulfur inclusion and coercivity of the alloy film on the additive concentration in the plating bath. To understand the cause of this difference, scanning tunneling microscopy (STM) was performed, using Au(111) as the substrate, to examine the structure of the adsorbed layers of the additive molecules. The result revealed that the nature of adsorption is fundamentally different for the two different additives; i.e., the adsorption of saccharin is physical and reversible, whereas thiourea undergoes irreversible chemisorption. This finding is consistent with the known behaviors of the two additives in the electroplating of nickel. In this paper the different effects of saccharin and thiourea in the electrodeposition of CoNiFe alloy are interpreted based on the STM results and relevant information available in the literature on the electrodeposition of nickel.

本文言語English
ページ(範囲)3295-3299
ページ数5
ジャーナルJournal of the Electrochemical Society
146
9
DOI
出版ステータスPublished - 1999 9月

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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