EHD micro pump using pyrolyzed polymer 3-D carbon mesh electrodes

Daisuke Wakui; Naoki Imai; Yasuhiro Nagaura; Hironobu Sato; Tetsushi Sekiguchi; Satoshi Konishi; Shuichi Sholil; Takayuki Homma

doi:10.1109/MEMSYS.2009.4805428

EHD micro pump using pyrolyzed polymer 3-D carbon mesh electrodes

Daisuke Wakui, Naoki Imai, Yasuhiro Nagaura, Hironobu Sato, Tetsushi Sekiguchi, Satoshi Konishi, Shuichi Sholil, Takayuki Homma

研究成果: Conference article › 査読

5 被引用数 (Scopus)

抄録

This paper presents the EHD (electro-hydrodynamic) micro pump using 3-D carbon mesh electrodes. The carbon electrodes were fabricated by pyrolysis of SU-8 micro mesh structures [1]. Low temperature SU-8 bonding method under 90°C was developed to realize wafer level carbon structure packaging. The pumping behaviors were evaluated using fluorinert as a sample solution. The maximum pressure and volume flow rate are about 23Pa and 400nL/min under applied voltage of 500V.

本文言語	English
論文番号	4805428
ページ（範囲）	499-502
ページ数	4
ジャーナル	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
DOI	https://doi.org/10.1109/MEMSYS.2009.4805428
出版ステータス	Published - 2009
イベント	22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 - Sorrento, Italy 継続期間: 2009 1 25 → 2009 1 29

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

文献へのアクセス

10.1109/MEMSYS.2009.4805428

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引用スタイル

@article{ac025bda952a4abbacdcceb28af0f097,

title = "EHD micro pump using pyrolyzed polymer 3-D carbon mesh electrodes",

abstract = "This paper presents the EHD (electro-hydrodynamic) micro pump using 3-D carbon mesh electrodes. The carbon electrodes were fabricated by pyrolysis of SU-8 micro mesh structures [1]. Low temperature SU-8 bonding method under 90°C was developed to realize wafer level carbon structure packaging. The pumping behaviors were evaluated using fluorinert as a sample solution. The maximum pressure and volume flow rate are about 23Pa and 400nL/min under applied voltage of 500V.",

author = "Daisuke Wakui and Naoki Imai and Yasuhiro Nagaura and Hironobu Sato and Tetsushi Sekiguchi and Satoshi Konishi and Shuichi Sholil and Takayuki Homma",

year = "2009",

doi = "10.1109/MEMSYS.2009.4805428",

language = "English",

pages = "499--502",

journal = "Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

issn = "1084-6999",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009 ; Conference date: 25-01-2009 Through 29-01-2009",

}

TY - JOUR

T1 - EHD micro pump using pyrolyzed polymer 3-D carbon mesh electrodes

AU - Wakui, Daisuke

AU - Imai, Naoki

AU - Nagaura, Yasuhiro

AU - Sato, Hironobu

AU - Sekiguchi, Tetsushi

AU - Konishi, Satoshi

AU - Sholil, Shuichi

AU - Homma, Takayuki

PY - 2009

Y1 - 2009

N2 - This paper presents the EHD (electro-hydrodynamic) micro pump using 3-D carbon mesh electrodes. The carbon electrodes were fabricated by pyrolysis of SU-8 micro mesh structures [1]. Low temperature SU-8 bonding method under 90°C was developed to realize wafer level carbon structure packaging. The pumping behaviors were evaluated using fluorinert as a sample solution. The maximum pressure and volume flow rate are about 23Pa and 400nL/min under applied voltage of 500V.

AB - This paper presents the EHD (electro-hydrodynamic) micro pump using 3-D carbon mesh electrodes. The carbon electrodes were fabricated by pyrolysis of SU-8 micro mesh structures [1]. Low temperature SU-8 bonding method under 90°C was developed to realize wafer level carbon structure packaging. The pumping behaviors were evaluated using fluorinert as a sample solution. The maximum pressure and volume flow rate are about 23Pa and 400nL/min under applied voltage of 500V.

UR - http://www.scopus.com/inward/record.url?scp=65949113622&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=65949113622&partnerID=8YFLogxK

U2 - 10.1109/MEMSYS.2009.4805428

DO - 10.1109/MEMSYS.2009.4805428

M3 - Conference article

AN - SCOPUS:65949113622

SP - 499

EP - 502

JO - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

JF - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

SN - 1084-6999

M1 - 4805428

T2 - 22nd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2009

Y2 - 25 January 2009 through 29 January 2009

ER -