Electrical characteristics of double-sided cooling SiC power module using Ni micro plating bonding

Tomoya Itose, Akihiro Kawagoe, Akihiro Imakiire, Masahiro Kozako, Masayuki Hikita, Kohei Tatsumi, Tomonori Iizuka, Isamu Morisako, Nobuaki Sato, Koji Shimizu, Kazutoshi Ueda, Kazuhiko Sugiura, Kazuhiro Tsuruta

研究成果: Conference contribution

抄録

This paper presents development of a double-sided cooling type SiC power module using Ni micro plating bonding at the SiC chip junctions for aiming at high heat resistance for hybrid electric vehicle (HEV) application and evaluates switching characteristics of the power module. It was found that the parasitic inductance at 10 MHz and surge voltage ?VDS of turn off waveform is reduced to 20% and 60%, respectively, compared with a conventional package type SiC power module using high temperature solder bonding composed by same chips.

本文言語English
ホスト出版物のタイトルCIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
出版社VDE VERLAG GMBH
ページ422-427
ページ数6
ISBN(電子版)9783800752263
出版ステータスPublished - 2020
イベント11th International Conference on Integrated Power Electronics Systems, CIPS 2020 - Berlin, Germany
継続期間: 2020 3 242020 3 26

出版物シリーズ

名前CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

Conference

Conference11th International Conference on Integrated Power Electronics Systems, CIPS 2020
国/地域Germany
CityBerlin
Period20/3/2420/3/26

ASJC Scopus subject areas

  • エネルギー工学および電力技術
  • 電子工学および電気工学

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