Electrochemical analysis of zincate treatments for Al and Al alloy films

Mikiko Saito, Takeyuki Maegawa, Takayuki Homma

研究成果: Article

20 被引用数 (Scopus)

抄録

Electrochemical behavior of Al and Al alloy films in zincate solution was investigated to elucidate the effect of the zincate pretreatment for electroless NiP deposition, which is used for under bump metallization for LSI interconnects. The immersion potential for AlCu and AlSiCu, immediately reached to constant, which was almost equal potential to zinc reference electrode. The corrosion current for the AlCu and AlSiCu films was larger than that of the Al and AlSi films in the zincate solution. It was also confirmed that the deposited Zn at the surface of AlCu and AlSiCu films possessed smaller grain size and larger amount of nucleation, resulted in the formation of flat NiP films.

本文言語English
ページ(範囲)1017-1020
ページ数4
ジャーナルElectrochimica Acta
51
5
DOI
出版ステータスPublished - 2005 11 10

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Electrochemistry

フィンガープリント 「Electrochemical analysis of zincate treatments for Al and Al alloy films」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル