Electrochemical analysis of zincate treatments for Al and Al alloy films

Mikiko Saito, Takeyuki Maegawa, Takayuki Homma

研究成果: Article

19 引用 (Scopus)

抄録

Electrochemical behavior of Al and Al alloy films in zincate solution was investigated to elucidate the effect of the zincate pretreatment for electroless NiP deposition, which is used for under bump metallization for LSI interconnects. The immersion potential for AlCu and AlSiCu, immediately reached to constant, which was almost equal potential to zinc reference electrode. The corrosion current for the AlCu and AlSiCu films was larger than that of the Al and AlSi films in the zincate solution. It was also confirmed that the deposited Zn at the surface of AlCu and AlSiCu films possessed smaller grain size and larger amount of nucleation, resulted in the formation of flat NiP films.

元の言語English
ページ(範囲)1017-1020
ページ数4
ジャーナルElectrochimica Acta
51
発行部数5
DOI
出版物ステータスPublished - 2005 11 10

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Electroless plating
Metallizing
Zinc
Nucleation
Corrosion
Electrodes

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Analytical Chemistry
  • Electrochemistry

これを引用

Electrochemical analysis of zincate treatments for Al and Al alloy films. / Saito, Mikiko; Maegawa, Takeyuki; Homma, Takayuki.

:: Electrochimica Acta, 巻 51, 番号 5, 10.11.2005, p. 1017-1020.

研究成果: Article

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