Electrochemical formation process of Si macropore and metal filling for high aspect ratio metal microstructure using single electrolyte system

Hirotaka Sato, Takayuki Homma, Kentaro Mori, Tetsuya Osaka, Shuichi Shoji

研究成果: Article

19 引用 (Scopus)

抜粋

Array of macropores filled with electrodeposited Ni was formed on Si substrate applying the novel process, which consists of Si electrochemical etching and Ni electrodeposition using single electrolyte. This electrolyte contained HF as Si dissolution agent and Ni(OSO2NH2) 2 4H2O as Ni2+ source for Ni electrodeposition. First, array of macropores was formed on Si (100) substrate by applying anodic current. The formation was carried out area-selectively by applying Au/Cr micropatterns formed at the back side surface of the substrate as the shade mask, which enables to control the illumination condition for hole generation condition. Subsequently, the applied bias was switched to cathodic current, and Ni was filled into c.a. 200 μm depth Si macropores without void-like defects. Array of Ni needles with smooth surface was formed area-selectively by removal of the Si region of the Ni filled specimen with 25 wt% tetramethylammonium hydroxide (TMAH) aqueous solution at 90°C.

元の言語English
ページ(範囲)275-278
ページ数4
ジャーナルElectrochemistry
73
発行部数4
DOI
出版物ステータスPublished - 2005 4

ASJC Scopus subject areas

  • Electrochemistry

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