Empirical Study on Specification Metrics to Predict Volatility and Software Defects

Taketo Tsunoda, Hironori Washizaki, Yoshiaki Fukazawa, Sakae Inoue, Yoshiiku Hanai, Masanobu Kanazawa

    研究成果: Conference contribution

    抄録

    Successful software implementation needs high-quality software requirement specifications (SRSs). However, SRSs are not only difficult to evaluate quantitatively, but there is not an effective indicator to predict which SRSs are prone to modifications. Moreover, few studies have investigated the impact of SRS quality on software quality. Herein we use two specification metrics for SRSs to evaluate their effectiveness to predict future modifications in two actual developments. The results show that our metrics are useful to predict future specification modifications and our specifications are closely related with software quality.

    元の言語English
    ホスト出版物のタイトルProceedings of TENCON 2018 - 2018 IEEE Region 10 Conference
    出版者Institute of Electrical and Electronics Engineers Inc.
    ページ2479-2484
    ページ数6
    ISBN(電子版)9781538654576
    DOI
    出版物ステータスPublished - 2019 2 22
    イベント2018 IEEE Region 10 Conference, TENCON 2018 - Jeju, Korea, Republic of
    継続期間: 2018 10 282018 10 31

    出版物シリーズ

    名前IEEE Region 10 Annual International Conference, Proceedings/TENCON
    2018-October
    ISSN(印刷物)2159-3442
    ISSN(電子版)2159-3450

    Conference

    Conference2018 IEEE Region 10 Conference, TENCON 2018
    Korea, Republic of
    Jeju
    期間18/10/2818/10/31

    Fingerprint

    Specifications
    Defects

    ASJC Scopus subject areas

    • Computer Science Applications
    • Electrical and Electronic Engineering

    これを引用

    Tsunoda, T., Washizaki, H., Fukazawa, Y., Inoue, S., Hanai, Y., & Kanazawa, M. (2019). Empirical Study on Specification Metrics to Predict Volatility and Software Defects. : Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference (pp. 2479-2484). [8650274] (IEEE Region 10 Annual International Conference, Proceedings/TENCON; 巻数 2018-October). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TENCON.2018.8650274

    Empirical Study on Specification Metrics to Predict Volatility and Software Defects. / Tsunoda, Taketo; Washizaki, Hironori; Fukazawa, Yoshiaki; Inoue, Sakae; Hanai, Yoshiiku; Kanazawa, Masanobu.

    Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc., 2019. p. 2479-2484 8650274 (IEEE Region 10 Annual International Conference, Proceedings/TENCON; 巻 2018-October).

    研究成果: Conference contribution

    Tsunoda, T, Washizaki, H, Fukazawa, Y, Inoue, S, Hanai, Y & Kanazawa, M 2019, Empirical Study on Specification Metrics to Predict Volatility and Software Defects. : Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference., 8650274, IEEE Region 10 Annual International Conference, Proceedings/TENCON, 巻. 2018-October, Institute of Electrical and Electronics Engineers Inc., pp. 2479-2484, 2018 IEEE Region 10 Conference, TENCON 2018, Jeju, Korea, Republic of, 18/10/28. https://doi.org/10.1109/TENCON.2018.8650274
    Tsunoda T, Washizaki H, Fukazawa Y, Inoue S, Hanai Y, Kanazawa M. Empirical Study on Specification Metrics to Predict Volatility and Software Defects. : Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc. 2019. p. 2479-2484. 8650274. (IEEE Region 10 Annual International Conference, Proceedings/TENCON). https://doi.org/10.1109/TENCON.2018.8650274
    Tsunoda, Taketo ; Washizaki, Hironori ; Fukazawa, Yoshiaki ; Inoue, Sakae ; Hanai, Yoshiiku ; Kanazawa, Masanobu. / Empirical Study on Specification Metrics to Predict Volatility and Software Defects. Proceedings of TENCON 2018 - 2018 IEEE Region 10 Conference. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 2479-2484 (IEEE Region 10 Annual International Conference, Proceedings/TENCON).
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