Rozkład energii napre{ogonek}żeń resztkowych w strukturach dwuwarstwowych

Yury Zimin, Toshitsugu Ueda, Joanna Pawłat

    研究成果: Article

    3 引用 (Scopus)

    抄録

    The analysis of energy of elastic strain induced by the residual stresses in bonded structure in the framework of Timoshenko's model has been done. The analysis revealed the energy is due to the forces aimed at splitting the structure. The energy as well as the splitting forces strongly depended on the thickness ratio of the bonded layers and the total thickness of the structure. The dependence included the point where splitting forces were equal zero (E 1h 1 2 = E 2h 2 2). The latter allows reducing the debonding problem, often appearing in the case of bonded structures of dissimilar materials, which becomes peculiarly important in micro and nanofabrication processes.

    元の言語Undefined/Unknown
    ページ(範囲)111-113
    ページ数3
    ジャーナルPrzeglad Elektrotechniczny
    88
    発行部数6
    出版物ステータスPublished - 2012

    Fingerprint

    Dissimilar materials
    Debonding
    Nanotechnology
    Residual stresses

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

    これを引用

    Rozkład energii napre{ogonek}żeń resztkowych w strukturach dwuwarstwowych. / Zimin, Yury; Ueda, Toshitsugu; Pawłat, Joanna.

    :: Przeglad Elektrotechniczny, 巻 88, 番号 6, 2012, p. 111-113.

    研究成果: Article

    Zimin, Y, Ueda, T & Pawłat, J 2012, 'Rozkład energii napre{ogonek}żeń resztkowych w strukturach dwuwarstwowych', Przeglad Elektrotechniczny, 巻. 88, 番号 6, pp. 111-113.
    Zimin, Yury ; Ueda, Toshitsugu ; Pawłat, Joanna. / Rozkład energii napre{ogonek}żeń resztkowych w strukturach dwuwarstwowych. :: Przeglad Elektrotechniczny. 2012 ; 巻 88, 番号 6. pp. 111-113.
    @article{2e2534e72a184e80bc18914bd1d2d227,
    title = "Rozkład energii napre{ogonek}żeń resztkowych w strukturach dwuwarstwowych",
    abstract = "The analysis of energy of elastic strain induced by the residual stresses in bonded structure in the framework of Timoshenko's model has been done. The analysis revealed the energy is due to the forces aimed at splitting the structure. The energy as well as the splitting forces strongly depended on the thickness ratio of the bonded layers and the total thickness of the structure. The dependence included the point where splitting forces were equal zero (E 1h 1 2 = E 2h 2 2). The latter allows reducing the debonding problem, often appearing in the case of bonded structures of dissimilar materials, which becomes peculiarly important in micro and nanofabrication processes.",
    keywords = "Bonding, Crystal quartz, Residual stress, Silicon, Surface processing, Thin surface coatings",
    author = "Yury Zimin and Toshitsugu Ueda and Joanna Pawłat",
    year = "2012",
    language = "Undefined/Unknown",
    volume = "88",
    pages = "111--113",
    journal = "Przeglad Elektrotechniczny",
    issn = "0033-2097",
    publisher = "Wydawnictwo SIGMA - N O T Sp. z o.o.",
    number = "6",

    }

    TY - JOUR

    T1 - Rozkład energii napre{ogonek}żeń resztkowych w strukturach dwuwarstwowych

    AU - Zimin, Yury

    AU - Ueda, Toshitsugu

    AU - Pawłat, Joanna

    PY - 2012

    Y1 - 2012

    N2 - The analysis of energy of elastic strain induced by the residual stresses in bonded structure in the framework of Timoshenko's model has been done. The analysis revealed the energy is due to the forces aimed at splitting the structure. The energy as well as the splitting forces strongly depended on the thickness ratio of the bonded layers and the total thickness of the structure. The dependence included the point where splitting forces were equal zero (E 1h 1 2 = E 2h 2 2). The latter allows reducing the debonding problem, often appearing in the case of bonded structures of dissimilar materials, which becomes peculiarly important in micro and nanofabrication processes.

    AB - The analysis of energy of elastic strain induced by the residual stresses in bonded structure in the framework of Timoshenko's model has been done. The analysis revealed the energy is due to the forces aimed at splitting the structure. The energy as well as the splitting forces strongly depended on the thickness ratio of the bonded layers and the total thickness of the structure. The dependence included the point where splitting forces were equal zero (E 1h 1 2 = E 2h 2 2). The latter allows reducing the debonding problem, often appearing in the case of bonded structures of dissimilar materials, which becomes peculiarly important in micro and nanofabrication processes.

    KW - Bonding

    KW - Crystal quartz

    KW - Residual stress

    KW - Silicon

    KW - Surface processing

    KW - Thin surface coatings

    UR - http://www.scopus.com/inward/record.url?scp=84861899119&partnerID=8YFLogxK

    UR - http://www.scopus.com/inward/citedby.url?scp=84861899119&partnerID=8YFLogxK

    M3 - Article

    AN - SCOPUS:84861899119

    VL - 88

    SP - 111

    EP - 113

    JO - Przeglad Elektrotechniczny

    JF - Przeglad Elektrotechniczny

    SN - 0033-2097

    IS - 6

    ER -