Enhancement of the ductility of electrodeposited copper films by room-temperature recrystallization

Madoka Hasegawa*, Yuichi Nonaka, Yoshinori Negishi, Yutaka Okinaka, Tetsuya Osaka

*この研究の対応する著者

研究成果: Article査読

32 被引用数 (Scopus)

抄録

In conjunction with a study of the copper electrodeposition process from the acid copper sulfate bath for the fabrication of interconnections of printed circuit boards and semiconductor devices, an investigation was performed of the effect of bath additives on the relationship between the ductility of the copper deposit and its crystallographic structure and electrical resistivity. Room-temperature recrystallization, or so-called self-annealing, is known to occur in copper electrodeposits obtained from baths containing Cl-, polyethylene glycol, and bis(3-sulfopropyl)disulfide as additives. Variation with time of the crystallographic orientation, grain size, and resistivity of the deposit was followed over a period of several weeks after the deposition. During the period of self-annealing, ductility was found to increase by a factor of 1.5. The increase in ductility is shown to be related to a change in microstructure of the copper deposit.

本文言語English
ページ(範囲)C117-C120
ジャーナルJournal of the Electrochemical Society
153
2
DOI
出版ステータスPublished - 2006 1月 20

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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