Envelope Estimation by Tangentially Constrained Spline

Tsubasa Kusano, Kohei Yatabe, Yasuhiro Oikawa

    研究成果: Conference contribution

    4 引用 (Scopus)

    抜粋

    Estimating envelope of a signal has various applications including empirical mode decomposition (EMD) in which the cubic C^2 -spline based envelope estimation is generally used. While such functional approach can easily control smoothness of an estimated envelope, the so-called undershoot problem often occurs that violates the basic requirement of envelope. In this paper, a tangentially constrained spline with tangential points optimization is proposed for avoiding the undershoot problem while maintaining smoothness. It is defined as a quartic C^2 -spline function constrained with first derivatives at tangential points that effectively avoids undershoot. The tangential points optimization method is proposed in combination with this spline to attain optimal smoothness of the estimated envelope.

    元の言語English
    ホスト出版物のタイトル2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Proceedings
    出版者Institute of Electrical and Electronics Engineers Inc.
    ページ4374-4378
    ページ数5
    2018-April
    ISBN(印刷物)9781538646588
    DOI
    出版物ステータスPublished - 2018 9 10
    イベント2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Calgary, Canada
    継続期間: 2018 4 152018 4 20

    Other

    Other2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018
    Canada
    Calgary
    期間18/4/1518/4/20

    ASJC Scopus subject areas

    • Software
    • Signal Processing
    • Electrical and Electronic Engineering

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  • これを引用

    Kusano, T., Yatabe, K., & Oikawa, Y. (2018). Envelope Estimation by Tangentially Constrained Spline. : 2018 IEEE International Conference on Acoustics, Speech, and Signal Processing, ICASSP 2018 - Proceedings (巻 2018-April, pp. 4374-4378). [8462203] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICASSP.2018.8462203