Evaluation of substrate (Ni)-catalyzed electroless gold plating process

T. Osaka*, T. Misato, J. Sato, H. Akiya, T. Homma, M. Kato, Y. Okinaka, O. Yoshioka

*この研究の対応する著者

研究成果: Article査読

20 被引用数 (Scopus)

抄録

The substrate (Ni)-catalyzed electroless gold plating process invented by Iacovangelo and Zarnoch has been investigated for plating gold on electroless nickel substrates for application to bonding of electronic devices. The process was found to yield uniform and adherent gold films on Ni-B substrates, whereas on Ni-P substrates acceptable gold films were obtained only when the P content was low and a pretreatment procedure was introduced to prevent the formation of surface oxide or to remove it completely. Unlike the conventional galvanic displacement process, the substrate-catalyzed process does not attack the nickel substrates and yields gold films with a very low porosity. Compared with autocatalytic electroless gold plating baths, the substrate-catalyzed bath is inherently more stable, although the maximum gold thickness obtainable is naturally limited. Results of these evaluations are presented in detail.

本文言語English
ページ(範囲)1059-1064
ページ数6
ジャーナルJournal of the Electrochemical Society
147
3
DOI
出版ステータスPublished - 2000 3月 1

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 再生可能エネルギー、持続可能性、環境
  • 表面、皮膜および薄膜
  • 電気化学
  • 材料化学

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