Evaluations of low temperature bonding using Au sub-micron particles for wafer level MEMS packaging

S. Ito, T. Ogashiwa, Y. Kanehira, H. Ishida, S. Shoji, J. Mizuno

研究成果: Conference contribution

4 被引用数 (Scopus)

抄録

This paper describes wafer level vacuum packaging with sub-micron Au particles for MEMS (micro electro mechanical systems) applications. Low temperature bonding is indispensable for relevant MEMS packaging, and use of sub-micron Au particles are suitable for hermetic seal bonding. For the fabrication of hermetically sealed wafer level packaging, a base silicon wafer and a cap glass wafer were bonded at around 200°C. Before bonding, the surface of seal rings was observed with a laser microscope to investigate the effect of surface roughness for hermeticity. After bonding, bonded wafers were dipped in the hydrofluoroether for 30 min. As a result, surface flatness of Au particles contributed to achieve hermetic sealing. Double seal rings structures were also useful to realize hermetic sealing.

本文言語English
ホスト出版物のタイトルAPM 2011 Proceedings - 2011 International Symposium on Advanced Packaging Materials
ページ342-347
ページ数6
DOI
出版ステータスPublished - 2011 12 1
イベント2011 International Symposium on Advanced Packaging Materials, APM 2011 - Xiamen, China
継続期間: 2011 10 252011 10 28

出版物シリーズ

名前Proceedings - International Symposium on Advanced Packaging Materials
ISSN(印刷版)1550-5723

Conference

Conference2011 International Symposium on Advanced Packaging Materials, APM 2011
CountryChina
CityXiamen
Period11/10/2511/10/28

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Materials Science(all)

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