Experiment and Simulation of Impregnated No-Insulation REBCO Pancake Coil

So Noguchi, Katsutoshi Monma, Sadanori Iwai, Hiroshi Miyazaki, Taizo Tosaka, Shunji Nomura, Tsutomu Kurusu, Hiroshi Ueda, Atsushi Ishiyama, Shinichi Urayama, Hidenao Fukuyama

研究成果: Article査読

8 被引用数 (Scopus)


It is important to investigate the stability and behavior of an epoxy-resin-impregnated no-insulation (NI) REBCO pancake coil to implement high-field applications, such as ultra-high-field magnetic resonance imaging. We have performed sudden discharging and overcurrent tests for the impregnated NI REBCO pancake coil. From the discharging test, the contact resistivity is estimated, and it changes depending on the initial current. From the overcurrent test, the high thermal stability of the impregnated NI REBCO pancake coil is confirmed. The REBCO pancake coil is charged up to 67 A though the critical current is only 46 A, and no degradation has been found. To investigate in detail the electromagnetic behavior of an impregnated NI REBCO pancake coil, the simulation is performed by means of the partial element equivalent circuit (PEEC) model. In the sudden discharging test, the simulation results for the case of lower initial current are in good agreement with the experimental data. As can be inferred from the simulation results, the current drastically decreases from the inside of the impregnated NI REBCO pancake coil. The result of the overcurrent simulation is almost identical to the experimental one. However, since the contact resistivity is presumed to be constant in the simulation, the difference is observed in the high current region.

ジャーナルIEEE Transactions on Applied Superconductivity
出版ステータスPublished - 2016 6月

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 凝縮系物理学
  • 電子工学および電気工学


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