抄録
Boiling and Two-phase flow in microgap channel has been recently proposed for cooling the heat sources directly in application of thermal management for electronic devices. Many researches were carried out to investigate the mechanism of heat transfer in the microgap channel. In this study, the boiling heat transfer and gas-liquid flow on the heated surface in microgap is investigated experimentally by using Temperature- Sensitive Paint (TSP). Experiments are performed in a single rectangular channel having microgap of 10 mm width, 35 mm heated length and 0.5 mm height using FC-72 as a test fluid with inlet subcooling 13.9 K under atmospheric pressure conditions. TSP coated on the heated wall is used to obtain the local temperatures and subsequently local heat transfer coefficients. In addition, simultaneous flow visualizations are conducted to observe and explore the flow boiling in microgap channel. Flow rate of FC-72 is 200 mg/s and heated water at 339 K is used as a heat source for boiling of the test fluid. Observation of gas-liquid behavior and measurement of the temperature distributions on the heated surface could be achieved at the same time by TSP. As a result, the heat flux of the rear side of a boiling bubble is 1.2-1.5 times higher than that of the front side of a bubble.
| 元の言語 | English |
|---|---|
| 出版物ステータス | Published - 2014 1 1 |
| 外部発表 | Yes |
| イベント | 15th International Heat Transfer Conference, IHTC 2014 - Kyoto, Japan 継続期間: 2014 8 10 → 2014 8 15 |
Other
| Other | 15th International Heat Transfer Conference, IHTC 2014 |
|---|---|
| 国 | Japan |
| 市 | Kyoto |
| 期間 | 14/8/10 → 14/8/15 |
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ASJC Scopus subject areas
- Mechanical Engineering
- Condensed Matter Physics
これを引用
Experimental investigations of flow boiling heat transfer and flow behaviors in microgap channel. / Kawamami, Osamu; Matsuda, yu; Egami, Yasuhiro; Honda, Itsuro; Yamaguchi, Hiroki; Niimi, Tomohide.
2014. 論文発表場所 15th International Heat Transfer Conference, IHTC 2014, Kyoto, Japan.研究成果: Paper
}
TY - CONF
T1 - Experimental investigations of flow boiling heat transfer and flow behaviors in microgap channel
AU - Kawamami, Osamu
AU - Matsuda, yu
AU - Egami, Yasuhiro
AU - Honda, Itsuro
AU - Yamaguchi, Hiroki
AU - Niimi, Tomohide
PY - 2014/1/1
Y1 - 2014/1/1
N2 - Boiling and Two-phase flow in microgap channel has been recently proposed for cooling the heat sources directly in application of thermal management for electronic devices. Many researches were carried out to investigate the mechanism of heat transfer in the microgap channel. In this study, the boiling heat transfer and gas-liquid flow on the heated surface in microgap is investigated experimentally by using Temperature- Sensitive Paint (TSP). Experiments are performed in a single rectangular channel having microgap of 10 mm width, 35 mm heated length and 0.5 mm height using FC-72 as a test fluid with inlet subcooling 13.9 K under atmospheric pressure conditions. TSP coated on the heated wall is used to obtain the local temperatures and subsequently local heat transfer coefficients. In addition, simultaneous flow visualizations are conducted to observe and explore the flow boiling in microgap channel. Flow rate of FC-72 is 200 mg/s and heated water at 339 K is used as a heat source for boiling of the test fluid. Observation of gas-liquid behavior and measurement of the temperature distributions on the heated surface could be achieved at the same time by TSP. As a result, the heat flux of the rear side of a boiling bubble is 1.2-1.5 times higher than that of the front side of a bubble.
AB - Boiling and Two-phase flow in microgap channel has been recently proposed for cooling the heat sources directly in application of thermal management for electronic devices. Many researches were carried out to investigate the mechanism of heat transfer in the microgap channel. In this study, the boiling heat transfer and gas-liquid flow on the heated surface in microgap is investigated experimentally by using Temperature- Sensitive Paint (TSP). Experiments are performed in a single rectangular channel having microgap of 10 mm width, 35 mm heated length and 0.5 mm height using FC-72 as a test fluid with inlet subcooling 13.9 K under atmospheric pressure conditions. TSP coated on the heated wall is used to obtain the local temperatures and subsequently local heat transfer coefficients. In addition, simultaneous flow visualizations are conducted to observe and explore the flow boiling in microgap channel. Flow rate of FC-72 is 200 mg/s and heated water at 339 K is used as a heat source for boiling of the test fluid. Observation of gas-liquid behavior and measurement of the temperature distributions on the heated surface could be achieved at the same time by TSP. As a result, the heat flux of the rear side of a boiling bubble is 1.2-1.5 times higher than that of the front side of a bubble.
KW - Boiling and evaporation
KW - Boiling heat transfer
KW - Measurement and instrumentation
KW - Microgap channel
KW - Temperature-sensitive paint
KW - Two-phase/Multiphase flow
UR - http://www.scopus.com/inward/record.url?scp=84964434737&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84964434737&partnerID=8YFLogxK
M3 - Paper
AN - SCOPUS:84964434737
ER -