Experimental verification of pH localization mechanism of particle consolidation at the electrode/solution interface and its application to pulsed DC electrophoretic deposition (EPD)

Laxmidhar Besra*, Tetsuo Uchikoshi, Tohru S. Suzuki, Yoshio Sakka

*この研究の対応する著者

研究成果査読

59 被引用数 (Scopus)

抄録

Experimental measurement and verification of the pH localization at the electrode/solution interface was conducted during continuous and pulsed DC electrophoretic deposition (EPD) from aqueous solution. Application of pulsed DC enabled controlling bubble incorporation and obtaining bubble-free deposits during electrophoretic deposition (EPD) from aqueous suspension. The pH localization at the electrode/solution interface on application of electric field was attributed as the underlying mechanism of particle consolidation during continuous as well as pulsed EPD. The suspension pH tends to shift towards isoelectric point (i.e.p.) leading to spontaneous coagulation of particles at the electrode. Application of continuous DC tends to attain the i.e.p. faster and closer compared to pulse DC leading to maximum deposit yield. The kinetics and closeness of attainment of pH towards i.e.p. decreased progressively with decreasing pulse size resulting in a corresponding decrease in deposit yield.

本文言語English
ページ(範囲)1187-1193
ページ数7
ジャーナルJournal of the European Ceramic Society
30
5
DOI
出版ステータスPublished - 2010 3 1
外部発表はい

ASJC Scopus subject areas

  • セラミックおよび複合材料
  • 材料化学

フィンガープリント

「Experimental verification of pH localization mechanism of particle consolidation at the electrode/solution interface and its application to pulsed DC electrophoretic deposition (EPD)」の研究トピックを掘り下げます。これらがまとまってユニークなフィンガープリントを構成します。

引用スタイル