This paper presents the fabrication method of 3-D Ni micromesh structures. Inverse-micromesh photoresist structures, fabricated by multiple inclined backside exposure, were used as molds for Ni electroplating. Ni micromeshes of about 3μm in diameter were realized by this method. This structure is useful for increasing the surface area of micro metal electrodes.
|出版ステータス||Published - 2004 12 1|
|イベント||Microfabricated Systems and MEMS VII - Proceedings of the International Symposium - Honolulu, HI, United States|
継続期間: 2004 10 3 → 2004 10 8
|Conference||Microfabricated Systems and MEMS VII - Proceedings of the International Symposium|
|Period||04/10/3 → 04/10/8|
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