Fabrication of a hermetic sealing device having I-structure TGV filled with submicron gold particles

Kazuya Nomura, Akiko Okada, Shuichi Shoji, Toshinori Ogashiwa, Jun Mizuno

研究成果: Conference contribution

抄録

We propose a hermetic sealing of a glass-to-glass structure which has an I-structure through-glass interconnect via (TGV) filled with submicron Au particles. A TGV sandwiched between two Au bumps is defined as I-structure TGV. The I-structure TGV was formed by the use of simple filling process with a resist hole and a vacuum condition. The samples were bonded at 200 °C under the vacuum of 0.50 Pa by using a low temperature Au/Au bonding pretreated with vacuum ultraviolet irradiation in the presence of oxygen gas (VUV/O3). The bonded samples showed He leakage rates of less than 5.0 × 10-9 Pa·m3 s-x1, which is the rejection limit defined by the MIL-STD-883G specification. This result indicates that proposed I-structure TGV is useful for a hermetic sealing device.

本文言語English
ホスト出版物のタイトル2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
出版社Institute of Electrical and Electronics Engineers Inc.
ページ46-49
ページ数4
ISBN(電子版)9781467383561
DOI
出版ステータスPublished - 2015 12 23
イベント10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Taipei, Taiwan, Province of China
継続期間: 2015 10 212015 10 23

出版物シリーズ

名前2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings

Other

Other10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015
国/地域Taiwan, Province of China
CityTaipei
Period15/10/2115/10/23

ASJC Scopus subject areas

  • 電子材料、光学材料、および磁性材料
  • 電子工学および電気工学

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