Fabrication of a microchannel device by hot embossing and direct bonding of poly(methyl methacrylate)

Hidetoshi Shinohara*, Jun Mizuno, Shuichi Shoji

*この研究の対応する著者

研究成果: Article査読

20 被引用数 (Scopus)

抄録

We have fabricated a 50-μm-wide and a 30-μm-deep microchannel device by hot embossing and the direct bonding of poly(methyl methacrylate) (PMMA) plates with dimensions of 20 × 20 × 1 mm3 and evaluated the device's mechanical, optical, and fluidic characteristics. The device's bond strength was confirmed to be sufficiently high for practical use as well as for withstanding severe cleaning conditions, such as ultrasonic cleaning in deionized water. The optical loss around the bonded interface was also evaluated, and no increase in light absorption was observed. There was no leakage or obstacles to smooth fluidic flow when methylene blue test liquid flowed in the channel. The above results confirmed that the hot embossing and direct bonding technologies for microchannel manufacturing using PMMA plates can realize high-performance microchannel devices.

本文言語English
ページ(範囲)3661-3664
ページ数4
ジャーナルJapanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers
46
6 A
DOI
出版ステータスPublished - 2007 6月 6

ASJC Scopus subject areas

  • 工学(全般)
  • 物理学および天文学(全般)

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